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From square to cube: Hardware processing for AI goes 3D, boosting processing power

In a paper published today in Nature Photonics, researchers from the University of Oxford, along with collaborators from the Universities of Muenster, Heidelberg, and Exeter, report on their development of integrated photonic-electronic hardware capable of processing three-dimensional (3D) data, substantially boosting data processing parallelism for AI tasks.

Close-up of a circuit board and other computer hardware

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Oxford to host new UK AI Research Lab

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